NES/Famicom chips die shots

RP2C02G:

It is a RP2C02G-0 9J5 50 chip decapsulated. Our decaper is working on delayering metal now.
Others chips will be decaped soon.

Nice! Great work! This work aught to really help demystify some of the behaviors of the good ol' NES

Thanks to Quietust now we have complete diffusion layer.

http://code.google.com/p/breaks/wiki/G2C02

gonna reverse engineer it completely soon.

There are so many mysteries regarding the PPU, I hope we can solve them all!

Would be interesting to see what's different between the G and H revisions.. maybe only die size? I guess some people who have VS arcade boards have found that certain games won't work with the 2A03H.

H-revision (including 2A03) should be depackaged and delayered soon also.

http://breaknes.com/ is started (sorry, english will be later)
Here is the download section: http://breaknes.com/download

Now we have the RP2C02G-0 9J5 50 decaped by Homer:
TOP_LAYER (Stitched), 220 Mb
NO_METAL (Stitched), 40 Mb
NO_METAL (Unstitched 180 slides package), 40 Mb

TOP_LAYER traced
NO_METAL traced (based on uxul.org delayered photo)
RP2C02G traced, Photoshop PSD-files, 260 Mb